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DiaSec Diamond Wafering Blade - General Purpose Metallography 5in Diamond Suspension Diameter: 10in (254mm)

SKU: 26334007135

4.4
USD155.00 USD182.00

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  • USA
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Ships within 48 hours · Estimated delivery Aug 1 - Aug 6

Description

Diameter: 10in (254mm)

: DSC-12806

Suitable for manual and automated polishing systems

Item APA-32

Item No CBM-2005

DiaSec Diamond Wafering Blade - General Purpose Metallography 5in Diamond Suspension Diameter: 10in (254mm)The DiaSec General Purpose Diamond Blade is a great choice for metallurgical sample sectioning. Made with metal bonding, this 5in blade can effortlessly cut through steel, stainless steel, copper, aluminum, Ni alloys, and titanium. Its versatility and precision make it an essential tool for any industry expert. Diameter: 5in (125mm) Thickness: 0. 020in (0. 5mm) Arbor: 0. 5in (12. 7mm) Item No DS 1005 1 pkg

Exchange/Return Notes
  • We offer a 30-day return/exchange service after receiving.
  • Final sale items are not eligible for returns or exchanges.
  • To process your return/exchange, please contact us at [email protected]
  • Please click here for more details>>> Return & Exchange Policy

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